2020-10-14 - Ansys

Ansys Expands Its Semiconductor Footprint and Stages Virtual User Conference

The rapid growth of the interest in Ansys’s semiconductor tools has prompted the company to stage a gathering of its…

2020-10-07 - Sally Ward-Foxton

Nvidia DPU Eyes NICs in Next-Gen Data Center

At its GTC Conference this week, Nvidia CEO Jensen Huang will unveil everything from its lowest-priced dev kit to a…

2020-10-06 - Anton Shilov

Taking a Closer Look at Intel’s Process Roadmap

Somewhat limited improvements of client and server CPUs coupled with delays of new process technologies made Intel look pale. But…

2020-10-05 - TrendForce

China’s Chip Sector Faces Possible Impact as SMIC Assesses Export Restrictions Placed by U.S.

SMIC made formal announcements assessing the Commerce Department’s notification to SMIC's suppliers that they will be restricted from shipping certain…

- Nitin Dahad and Maurizio Di Paolo Emilio

NXP Advance 5G with New 150mm GaN Fab in Arizona

NXP opened a new GaN fab in Arizona to focus primarily on the communications infrastructure market for 5G radio systems,…

2020-09-30 - Alan Patterson

U.S. Restricts Tech Exports to China’s SMIC

The U.S. is reported to have restricted exports to SMIC, citing the possibility the technology could support China's military...

2020-09-24 - Alan Patterson

MRAM Startup Poised to Win Broad Adoption

MRAM specialist Spin Memory attracted some important allies as it goes after the U.S. military memory market...

2020-09-23 - George Leopold

U.S. Fab Emphasis Questioned as Chip Industry Lobbying

Skeptics question the wisdom of subsidizing new U.S. fabs at the expense of next-generation chip technologies...

2020-09-22 - IC Insights

Pure-Play Foundry Market On Pace For Strongest Growth Since 2014

Application processors and other device sales for 5G smartphones act as a robust driver.

2020-09-18 - SEMI

North American Semiconductor Equipment Industry Posts August 2020 Billings

North America-based manufacturers of semiconductor equipment posted $2.65 billion in billings worldwide in August 2020 (three-month average basis), according to SEMI...

2020-09-16 - Yole Développement

Advanced Packaging: Strong Momentum Driven by TSMC, Intel and Samsung

Advanced packaging (AP) is moving from a package substrate platform to silicon, a shift that is providing opportunities for giants…

2020-09-15 - George Leopold

AI Race: There’s Some Things Money Can’t Buy

AI competition is looking like a new cold war. China leads in R&D investment and published papers, but U.S. still…