2017-06-28 - EE Times Asia

4-terminal resistors offer 0.33W power ratings

The resistors' four-terminal Kelvin connection enables greater measurement accuracy with low resistance values from 0.01Ω to 0.1Ω and tolerance of…

2017-06-19 - EE Times Asia

Surface-mount power modules offer up to 100W output

The new modules deliver high conduction and switching efficiency, especially in hard-switching circuits at frequencies up to 20kHz, according to…

2017-06-16 - EE Times Asia

Power module targets subsea industrial apps

The PRBX VB410-380 is designed to offer maximum level of isolation between the high-voltage input and the low-voltage output, according…

2017-06-09 - Infineon Technologies

Power PROFETs replace relays, fuses in cars

Infineon claims its FETs offer over 1 million switching cycles and replace several components, including relays, fuses, relay drivers, cables…

2017-05-23 - Vivek Nanda

Microsemi, ADI partner on SiC-based ref design

The reference design provides a highly isolated SiC MOSFET dual-gate driver switch for evaluating SiC MOSFETs in a number of…

2017-05-16 - Dr. Peter Wawer

Mainstream SiC adoption reaches tipping point

The reduced price and increased availability of SiC has resulted in demand from power designers under pressure to address legislative…

- EE Times Asia

1,200V SiC diodes achieve up to 40A current ratings

The automotive-grade diodes feature low forward voltage drop for optimal efficiency in electric vehicle applications, according to ST.

2017-03-27 - EE Times Asia

100Mbps data isolator integrates DC/DC converter

The ISOW7841 reduces device operating temperature by up to 40°C, resulting in higher power delivery and higher channel count, according…

2017-03-09 - Weltrend

PD controllers handle data, power with USB-IF seal

Weltrend’s WT6615F and WT6632F USB power delivery controllers support from 3V up to 30V range without an external LDO.

2017-02-28 - UMC

UMC begins mass production of 14nm ICs

UMC’s 14nm FinFET wafers feature 55% higher speed and twice the gate density over 28nm process technology.

2017-01-20 - Molex

Fully protected power connectors reduce size to 2.5mm

Molex’s Nano-Fit power connectors have multiple colour and mechanical keying options to help designers reduce the risk of cross mating.

2017-01-16 - Toshiba

TVS diodes secure high-speed interfaces in wearables

The TVS diodes are fabricated with EAP-IV process that utilises Toshiba’s snapback technology for improved system reliability.