Intel Looks to Get Its Groove Back
Intel demonstrated that architectural innovation can be just as important as process shrinks. Intel's Xe, for example, looks able to…
ASE Takes the Crown Among Top 10 OSAT Companies in 2Q20
China-U.S. relations and the pandemic’s outlook are key factors determining global OSAT revenue in 2H20...
SMD Package Gets Space-Ready for Rad-Hard MOSFETs
Conditions in space pose multiple challenges for electronics reliability. A new line of SMD packages is engineered to meet those…
Global Semiconductor Packaging Materials Market to Reach $20.8B by 2024
The global semiconductor packaging materials market will track chip industry growth to expand from $17.6 billion in revenue logged in…
Chip Manufacturing Equipment Spending to Hit Record High $70B in 2021
Global sales of semiconductor manufacturing equipment by OEMs are projected to increase 6% to $63.2 billion in 2020 compared to…
SEMI Applauds Senate Support of Financial Incentives to Grow U.S. Semiconductor Manufacturing
SEMI President and CEO Ajit Manocha has voiced his support for amendments the U.S. House of Representatives and Senate included…
Chiplets Promise to Revive Moore’s Law
Die-stitching techniques, the basic concept behind chiplets, aren’t new or necessarily propriety, but the approach could benefit from templates.
How SiC FETs Are Changing the Semiconductor Landscape
The current generation of leading SiC devices has changed the face of the semiconductor industry; what sectors will be the…
Silicon Photonics: Datacom, yes, but not only…
Silicon photonics is expected to be a key technology for network switches in the next five years with CPO, and…
Ask the Expert: Q&A with Process Engineers
An in-depth interview with Arijit Raychowdhury, a professor at Georgia Tech, on where the electronics industry is heading, and what…
Infineon Prepares for Growth in Hybrid Vehicles
Significant growth in automotive 48 V systems in the coming years and is expanding its portfolio of suitable power devices.
TSMC/Arm Unveil 3DIC Made of Chiplets
TSMC provided a peek at its plans for packaging three-dimensional chips that push performance higher, power consumption lower and transistor…
