2020-12-28 - Majeed Ahmad

Advanced Packaging For More-than-Moore Era

Chip scaling has reached the point of diminishing returns. The next phase of semiconductor innovation will focus on integrating a…

2020-12-17 - Don Scansen

Teardown: Identifying Apple M1’s Distinct Circuit Blocks

Apple M1, the first product from Apple’s chip design team meant for the personal computer line, surpassed many competing microprocessors.

2020-12-03 - Don Scansen

Qorvo Advances in RF “SHIP” Program

The latest from the SHIP program was a $75 million commitment to Qorvo for its RF production and prototyping center...

2020-11-23 - GUC

Die-to-Die Solution Opening the New Era of Flagship SoC

Global Unichip Corp. (GUC) has demonstrated the silicon-proven GLink (GUC multi-die interLink) interface using TSMC 7nm process and TSMC InFO_oS…

2020-11-18 - Brian Chislea & Erica J. Everett

Getting Started with Silicone Conformal Coatings

Solventless conformal coatings that are made of silicone support sustainability initiatives and can improve production efficiency...

2020-11-17 - TrendForce

TOP 10 OSATs Ranking 2020: Amkor Scores Highest YoY Growth

TrendForce announced the Top 10 largest OSAT companies’ revenues exceed US$6.7 billion, while Amkor scores highest YoY growth...

2020-11-12 - Nitin Dahad

CEA-Leti, Intel Expand Collaboration on 3D Packaging

3D packaging research will focus on assembly of smaller chiplets, optimizing interconnection technologies between the different elements of microprocessors, and…

2020-11-11 - Brian Santo

Advanced Packaging: Interview with Intel’s Ramune Nagisetty

The IC industry is renewing its focus on advanced packaging. Chiplets may be the least mature option, but it is…

2020-11-05 - Don Scansen

5G and Interconnect Are Pushing Innovations in Wireless

Packaging and interconnect are critical to achieving wireless systems that perform “better than wired”...

2020-10-16 - Don Scansen

How Is Intel Part of a “SHIP” Program?

There is nothing new about young men killing themselves through their own stupidity. While tragic, this has been happening since…

2020-09-16 - Yole Développement

Advanced Packaging: Strong Momentum Driven by TSMC, Intel and Samsung

Advanced packaging (AP) is moving from a package substrate platform to silicon, a shift that is providing opportunities for giants…

2020-08-21 - Kevin Krewell

Intel Looks to Get Its Groove Back

Intel demonstrated that architectural innovation can be just as important as process shrinks. Intel's Xe, for example, looks able to…