2021-11-23 - Samsung Electronics Co. Ltd

Samsung Electronics Expands Portfolio of ‘Green’ Chips

Five memory products achieved carbon reduction certification, while automotive LED packages received carbon footprint verification.

2021-11-09 - Amkor Technology Inc.

Amkor Plans New Vietnam Factory to Expand Advanced Packaging Technology Capacity

Amkor plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam to expand its advanced packaging technology capacity.

2021-10-14 - Xperi Holding Corp.

YMTC Licenses Xperi’s Hybrid Bonding Technology

Xperi has licensed its Direct Bond Interconnect (DBI) hybrid bonding portfolio to YMTC for its 3D NAND memory products.

2021-06-29 - Keesjan Engelen

Taiwan Electronics Update

Taiwan really contributes more value to the iPad Pro than accounted for.

2021-06-02 - Don Scansen

What to Expect at the VLSI Technology Symposium

The papers from the upcoming VLSI Technology Symposium suggest there's some agreement on general direction, but little agreement on terminology.

2021-05-28 - Global Unichip Corp.

GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process

GUC has announced GLink-3D die-on-die interface IP using TSMC’s N5 and N6 processes, and 3DFabric packaging technology for AI, HPC,…

2021-04-01 - Ravi Mahajan

Optimizing Package System Integration Maximizes System Performance

Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.

2021-03-30 - Keith Felton

5 Key Considerations for Next-Gen IC Packaging Design

Next-generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall…

2021-03-25 - Rich Quinnell

Will FOWLP Keep Moore’s Law Valid?

Moore's Law in process technology is on its last legs, so advanced packaging is taking up the baton.

2021-03-16 - Don Scansen

A Short History of Chiplets

The idea of the disagreggation of ICs into smaller physical pieces of silicon—chiplets—has been generating buzz for some time.

2021-03-08 - Don Scansen

Squaring the Circle: A Look at Deca Technologies’ Innovations

Deca knows new approaches are needed to continue to scale production, as well as to address the demands of "More…

2021-03-02 - Don Scansen

ISSCC: Roadmap on 3D Interconnect Density

The common theme coming out of the chiplet forum at ISSCC was the need for a 3D interconnect density roadmap.