Tanaka Denshi Kogyo to Establish New Plant in China
Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power…
Nepes Laweh Sets New Industry Benchmark with 600mm Large Panel Fan-Out Volume Production
Nepes has successfully produced the world's first 600mm x 600mm large panel level packaging (PLP) using Deca's M-Series fan-out technologies.
Heterogeneous Integration Chiplet System Package Alliance Established
The Hi-CHIP alliance will help create a complete ecosystem covering package design, testing and verification, and pilot production.
Applied Materials, IME Extend Hybrid Bonding Research
Applied Materials and Singapore's IME will extend research via a combined $210 investment aimed at advancing hybrid bonding technology.
TSMC Newest N4X Process Targets HPC Products
N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family.
Samsung Electronics Expands Portfolio of ‘Green’ Chips
Five memory products achieved carbon reduction certification, while automotive LED packages received carbon footprint verification.
Amkor Plans New Vietnam Factory to Expand Advanced Packaging Technology Capacity
Amkor plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam to expand its advanced packaging technology capacity.
YMTC Licenses Xperi’s Hybrid Bonding Technology
Xperi has licensed its Direct Bond Interconnect (DBI) hybrid bonding portfolio to YMTC for its 3D NAND memory products.
Taiwan Electronics Update
Taiwan really contributes more value to the iPad Pro than accounted for.
What to Expect at the VLSI Technology Symposium
The papers from the upcoming VLSI Technology Symposium suggest there's some agreement on general direction, but little agreement on terminology.
GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process
GUC has announced GLink-3D die-on-die interface IP using TSMC’s N5 and N6 processes, and 3DFabric packaging technology for AI, HPC,…
Optimizing Package System Integration Maximizes System Performance
Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.
