Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power…
Nepes has successfully produced the world's first 600mm x 600mm large panel level packaging (PLP) using Deca's M-Series fan-out technologies.
The Hi-CHIP alliance will help create a complete ecosystem covering package design, testing and verification, and pilot production.
Applied Materials and Singapore's IME will extend research via a combined $210 investment aimed at advancing hybrid bonding technology.
N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family.
Five memory products achieved carbon reduction certification, while automotive LED packages received carbon footprint verification.
Amkor plans to build a state-of-the-art smart factory in Bac Ninh, Vietnam to expand its advanced packaging technology capacity.
Xperi has licensed its Direct Bond Interconnect (DBI) hybrid bonding portfolio to YMTC for its 3D NAND memory products.
The papers from the upcoming VLSI Technology Symposium suggest there's some agreement on general direction, but little agreement on terminology.
GUC has announced GLink-3D die-on-die interface IP using TSMC’s N5 and N6 processes, and 3DFabric packaging technology for AI, HPC,…
Closer collaborations between package and system designers to optimize package system integration will help maximize system performance.