2022-05-27 - Smiths Interconnect

Optimizing Production Test of QFN-packaged ICs for Consumer, Automotive, Industrial, and Power Applications

QFN packages offer myriad advantages, but also bring a new set of testing challenges.

2022-05-05 - Xperi Holding Corp.

Xperi and LAPIS Enter into Hybrid Bonding License Agreement

Adeia and LAPIS have signed a technology transfer agreement, which includes the DBI Ultra die-to-wafer hybrid bonding know-how.

2022-05-03 - SEMI

Unisem Wins MEMS Packaging Process Showdown at MEMS & Sensors Technical Congress

Unisem showcased unique designs and effective packaging techniques to meet the needs of a wide range of MEMS and sensors…

2022-04-14 - ChipMOS Technologies Inc.

ChipMOS March 2022 Revenue Up 12% MoM

ChipMOS has reported unaudited consolidated revenue of NT$2.355 billion ($82.3 million), up by 12.3% month-on-month.

2022-04-13 - VeriSilicon

VeriSilicon Joins the UCIe Industry Consortium

VeriSilicon has officially joined the Universal Chiplet Interconnect Express (UCIe) industry consortium.

2022-04-11 - Gary Hilson

Chiplets Get a Formal Standard with UCIe 1.0

The recently announced UCIe 1.0 specification provides a complete standardized die–to–die interconnect with physical layer, protocol stack, software model, and…

2022-03-21 - SJ Semiconductor Co.

SJSemi Successfully Closes $300M of Series C Financing

SJ Semiconductor has completed its Series C financing of $300 million.

2022-03-08 - Universal Chiplet Interconnect Express

Industry Leaders Join Forces to Standardize Chiplet Ecosystem

Industry leaders have formed a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

2022-01-12 - ACN Newswire

Tanaka Denshi Kogyo to Establish New Plant in China

Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power…

2021-12-29 - Nepes Laweh Corp.

Nepes Laweh Sets New Industry Benchmark with 600mm Large Panel Fan-Out Volume Production

Nepes has successfully produced the world's first 600mm x 600mm large panel level packaging (PLP) using Deca's M-Series fan-out technologies.

- Industrial Technology Research Institute

Heterogeneous Integration Chiplet System Package Alliance Established

The Hi-CHIP alliance will help create a complete ecosystem covering package design, testing and verification, and pilot production.

- Stefani Munoz

Applied Materials, IME Extend Hybrid Bonding Research

Applied Materials and Singapore's IME will extend research via a combined $210 investment aimed at advancing hybrid bonding technology.