Optimizing Production Test of QFN-packaged ICs for Consumer, Automotive, Industrial, and Power Applications
QFN packages offer myriad advantages, but also bring a new set of testing challenges.
Xperi and LAPIS Enter into Hybrid Bonding License Agreement
Adeia and LAPIS have signed a technology transfer agreement, which includes the DBI Ultra die-to-wafer hybrid bonding know-how.
Unisem Wins MEMS Packaging Process Showdown at MEMS & Sensors Technical Congress
Unisem showcased unique designs and effective packaging techniques to meet the needs of a wide range of MEMS and sensors…
ChipMOS March 2022 Revenue Up 12% MoM
ChipMOS has reported unaudited consolidated revenue of NT$2.355 billion ($82.3 million), up by 12.3% month-on-month.
VeriSilicon Joins the UCIe Industry Consortium
VeriSilicon has officially joined the Universal Chiplet Interconnect Express (UCIe) industry consortium.
Chiplets Get a Formal Standard with UCIe 1.0
The recently announced UCIe 1.0 specification provides a complete standardized die–to–die interconnect with physical layer, protocol stack, software model, and…
SJSemi Successfully Closes $300M of Series C Financing
SJ Semiconductor has completed its Series C financing of $300 million.
Industry Leaders Join Forces to Standardize Chiplet Ecosystem
Industry leaders have formed a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.
Tanaka Denshi Kogyo to Establish New Plant in China
Tanaka Denshi Kogyo will establish a new plant in Hangzhou, China, for the production of aluminum bonding wires for power…
Nepes Laweh Sets New Industry Benchmark with 600mm Large Panel Fan-Out Volume Production
Nepes has successfully produced the world's first 600mm x 600mm large panel level packaging (PLP) using Deca's M-Series fan-out technologies.
Heterogeneous Integration Chiplet System Package Alliance Established
The Hi-CHIP alliance will help create a complete ecosystem covering package design, testing and verification, and pilot production.
Applied Materials, IME Extend Hybrid Bonding Research
Applied Materials and Singapore's IME will extend research via a combined $210 investment aimed at advancing hybrid bonding technology.
