FlexPoint laser modules get upgraded focusing mechanism
The new focusing mechanism allows stable beam positioning and low line positioning drift in machine vision, and offers focusing options…
Samsung rolls out 220lm/W LED package
The LM301B incorporates a flip-chip design and phosphor technology that Samsung says enables a 10% increase in overall efficacy.
UV curing systems market to reach $8.2B by 2021
Global UV curing systems market is expected to reach $8,206 million by 2021, growing at a CAGR of about 15%.
Compact LEDs deliver 14cd luminous intensity
Featuring the ultrabright AllnGaP on Si chip technology, the VLD.1535 series offers an emission angle of ±22° without the need…
Cree, San’an JV targets mid-power lighting
The JV helps Cree expand from the high-power product segment into mid-power lighting class LED packaged products with initial product…
EUV lithography scanner aims to produce 104 wafers/h
The ASML NXE:3400B EUV lithography scanner runs at 148W to produce 104 wafers/h, capable of creating overlays within a 3nm…
Review system inspects mask at EUV level
Inspections of up to 14nm mask defects or a detector supporting 2,000Hz frame rate are just two uphill tests to…
Manufacturers pick EUV combos
Co-optimisation tools are now becoming mainstream to help translate between different worlds of chip designers and lithographers.
R&D project targets LED design enhancement
The FLINGO project focuses on the functional layers and processes to develop LEDs for lifetime electrical resistance and improved light…
Transparent screen turns windows into digital signage
Panasonic has combined glass with high-contrast light-control film consisting of a transparent-cloudy white switching layer and a hue control layer.
3D hologram adopts SLM, DM for hi-res displays
Adding diffusers or frosted glasses to wavefront modulators in 3D holographic display improves the size and viewing angle by more…
Fabric-based electrodes brighten OLED future
Sefar fabric-based electrodes simplify the large-area OLED production by eliminating the evaporation, photolithography and electrical insulation.
