Cadence Solutions Accelerate Development of Mobile, Automotive, and Hyperscale Systems
Cadence's Helium Virtual and Hybrid Studio enables high-performance pre-silicon software validation in virtual and hybrid configurations.
Single-chip GaN Gate Driver Boosts Speed and Integration in Industrial, Home Automation
ST's STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay to handle high-frequency switching of GaN enhancement-mode…
Seoul Semiconductor WICOP TE Improves Thermal Efficiency of Headlamps for EVs
Seoul Semiconductor has launched the WICOP TE (Top Electrode) designed to significantly improve the thermal efficiency of headlamps for vehicles.
onsemi Powers Every Node in Ramaxel’s Next-gen Servers
Ramaxel has selected intelligent cloud power technologies from onsemi for its upcoming Intel-based VR13.HC servers.
Keysight Test Solution Accelerates Silicon Photonics Wafer Production
Keysight's NX5402A Silicon Photonics Wafer Test System delivers quick volume production launch with stability and repeatability.
STMicroelectronics New MasterGaN Devices Targeted at High-efficiency Power Conversion
STMicroelectronics has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively.
Microchip CSAC Features Ultra-high Precision and Low Power Consumption
Microchip's new chip scale atomic clock provides wider operating temperatures, faster warm-up, and improved frequency stability in extreme environments.
I2C Serial EEPROM Features 3.4MHz High-Speed Mode Operation
Microchip Technology's 3.4MHz I2C Serial EEPROM closes the gap in trade-offs between SPI and I2C protocols.
ASRock’s Edge AIoT Platform Empowers Smart Factories, AVs
ASRock's new series provides super computing power, rich I/Os, expansions under the compact size, and ruggedness, for smart factory, AV…
Microchip Mid-range FPGAs Tout Low Power Consumption for Edge Compute Systems
Microchip's new low-density PolarFire devices consume half the static power of alternatives while providing the smallest thermal footprint.
Rambus HBM3-Ready Memory Subsystem Advances AI/ML Performance
Rambus' HBM3-ready memory interface subsystem supports breakthrough data rates of up to 8.4Gbps and can deliver over 1Tbps of bandwidth.
STMicroelectronics DC/DC Converter ICs Reduce BOM Costs in Automotive, Industrial Applications
The DC/DC converter ICs ensure energy-efficient operation in automotive and industrial applications up to 5W.
