Cadence's Helium Virtual and Hybrid Studio enables high-performance pre-silicon software validation in virtual and hybrid configurations.
ST's STDRIVEG600 half-bridge gate driver has high current output and 45ns propagation delay to handle high-frequency switching of GaN enhancement-mode…
Seoul Semiconductor has launched the WICOP TE (Top Electrode) designed to significantly improve the thermal efficiency of headlamps for vehicles.
Keysight's NX5402A Silicon Photonics Wafer Test System delivers quick volume production launch with stability and repeatability.
STMicroelectronics has released the MasterGaN3 and MasterGaN5 integrated power packages for applications up to 45W and 150W, respectively.
Microchip's new chip scale atomic clock provides wider operating temperatures, faster warm-up, and improved frequency stability in extreme environments.
Microchip Technology's 3.4MHz I2C Serial EEPROM closes the gap in trade-offs between SPI and I2C protocols.
ASRock's new series provides super computing power, rich I/Os, expansions under the compact size, and ruggedness, for smart factory, AV…
Microchip's new low-density PolarFire devices consume half the static power of alternatives while providing the smallest thermal footprint.
Rambus' HBM3-ready memory interface subsystem supports breakthrough data rates of up to 8.4Gbps and can deliver over 1Tbps of bandwidth.
The DC/DC converter ICs ensure energy-efficient operation in automotive and industrial applications up to 5W.