Advanced Dielectric Gapfill Technology to Enable Next-Gen Memory
Lam Research’s recently announced Striker FE enhanced atomic layer deposition (ALD) platform addresses semiconductor manufacturing challenges for 3D NAND as…
Memory Startup Brings FeFET Solutions to NVM Market
With hafnium oxide present in the gate insulator of every CMOS transistor, FMC's FeFET memory aims to turn any logic…
World’s First 176-Layer NAND Achieves Breakthrough Performance and Density
Micron delivers a breakthrough in flash memory performance and density...
Emerging Technologies Propelling Wafer Fab Investments
Emerging technologies and new uses cases are propelling wafer fab investments...
How AI Impacts Memory & Interconnect Technology
When it comes AI and machine learning applications, it's increasingly important where data and memory need to reside....
China’s YMTC is Poised to Lead in NAND Flash Technology
China’s YMTC aims to lead competitors like Samsung and Micron in NAND flash technology and will very likely license its…
DDR5 Era to Officially Begin in 2021
Owing to BOM cost limitations, DDR5 integration for both Intel and AMD PC platforms will be delayed to 2022...
Kingston, ADATA, Tigo Take Top Spots in 2019 Ranking of Top 10 SSD Module Makers
Worldwide shipments of branded SSDs bound for the channel (retail) market in 2019 reached 131 million units, showing an increase…
SK Hynix to Possess Second Highest NAND Market Share via Acquisition of Intel’s NAND Unit
SK Hynix has announced today (Oct. 20) that it will acquire Intel’s NAND Flash business and Dalian-based Fab 68, which…
Samsung Widens its Lead in the Smartphone DRAM & NAND Market in 1H20
High-density chips drive market revenue...