Total DRAM revenue in 1Q22 decreased by 4% QoQ, reaching $24.03 billion, amid market inflation, weakening demand, and the outbreak…
Micron Technology unveiled a new DRAM roadmap and pricing model at its Micron Investor Day 2022 event.
At IMW 2022 this week, imec presented new liquid-based memory concepts for nearline storage.
NAND Flash wafer prices are expected to begin falling in May, while supply will gradually overtake demand in the second…
Samsung's CXL memory packs 4x the capacity over the previous version, enabling a server to scale to tens of terabytes…
Microchip's SST26LF064RT memory device is its second SuperFlash technology-based offering to be space qualified.
Kioxia is donating ¥100 million to support the humanitarian assistance and relief for those affected by the ongoing conflict in…
Lam Research's selective etch tools aim to help chipmakers leap from planar to 3D structures.
Winbond is adding new wafer capacity in its fab in Kaohsiung, Taiwan, starting from the fourth quarter of this year.
When adopting DDR5 industrial memory, what’s the best way to grasp the advantages and seize the market opportunity?
Winbond and Infineon are expanding their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.
SMART Modular's memory AIC is targeted for hyperscalers and data centers running large databases on AMD, ARM, and Intel CPU-based…