2022-05-23 - TrendForce

TrendForce: Global DRAM Revenue Down 4% QoQ in 1Q22

Total DRAM revenue in 1Q22 decreased by 4% QoQ, reaching $24.03 billion, amid market inflation, weakening demand, and the outbreak…

- Gary Hilson

Micron Discusses Business Updates

Micron Technology unveiled a new DRAM roadmap and pricing model at its Micron Investor Day 2022 event.

2022-05-19 - Maarten Rosmeulen

A Look at Liquid-based Memory Technologies

At IMW 2022 this week, imec presented new liquid-based memory concepts for nearline storage.

2022-05-13 - TrendForce

NAND Flash Wafer Pricing Leads Downturn in May Amid Sluggish Consumer Electronics Demand

NAND Flash wafer prices are expected to begin falling in May, while supply will gradually overtake demand in the second…

2022-05-11 - Samsung Electronics Co. Ltd

Samsung Launches Industry’s First 512GB CXL Memory Module

Samsung's CXL memory packs 4x the capacity over the previous version, enabling a server to scale to tens of terabytes…

2022-04-28 - Microchip Technology Inc.

Microchip Memory Device Extends Options for Designing Space Systems

Microchip's SST26LF064RT memory device is its second SuperFlash technology-based offering to be space qualified.

- Kioxia Corp.

Kioxia to Donate ¥100M in Humanitarian Assistance for Ukraine

Kioxia is donating ¥100 million to support the humanitarian assistance and relief for those affected by the ongoing conflict in…

- Gary Hilson

Etch Tools Continue 3D Evolution to Keep Pace with Moore’s Law

Lam Research's selective etch tools aim to help chipmakers leap from planar to 3D structures.

2022-04-26 - Winbond Electronics Corp.

Winbond Expanding DDR3 SDRAM Production

Winbond is adding new wafer capacity in its fab in Kaohsiung, Taiwan, starting from the fourth quarter of this year.

- Apacer

What Sets DDR5 Memory Apart?

When adopting DDR5 industrial memory, what’s the best way to grasp the advantages and seize the market opportunity?

2022-04-20 - Winbond Electronics Corp.

Winbond and Infineon Technologies Expand HYPERRAM Collaboration

Winbond and Infineon are expanding their HYPERRAM product collaboration with the new higher bandwidth HYPERRAM 3.0.

2022-04-19 - SMART Modular Technologies Inc.

SMART Modular Launches PCIe Optane Memory Add-in-Card

SMART Modular's memory AIC is targeted for hyperscalers and data centers running large databases on AMD, ARM, and Intel CPU-based…