Micron Powering the Future of Memory
Micron highlights the latest innovations and technology developments shaping the future of memory.
Apacer Debuts Next-Gen DDR5, Patented Compact SSDs at COMPUTEX Virtual 2021 Online
Apacer will launch stunning new products, including next-gen DDR5 and compact SSDs, at the COMPUTEX Virtual 2021 Online Exhibition this…
Majority of Top 20 APAC Tech Firms Managed to Post Growth in 2020
Increasing investments in digital transformation, data centers and IoT deployment were instrumental in the more than 5% average revenue growth…
GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process
GUC has announced GLink-3D die-on-die interface IP using TSMC’s N5 and N6 processes, and 3DFabric packaging technology for AI, HPC,…
AI Driving Renewed Interest in Processing-in-Memory
Samsung's new processing-in-memory architecture places AI computing capabilities inside a high bandwidth memory (HBM).
Kioxia Expands Yokohama Tech Campus, Strengthens R&D
Kioxia is strengthening its flash memory and SSD technology development capabilities to meet increasing demand.
Memory IC Industry Forecast to Achieve Record Highs in 2022
Fueled by economic recovery and the transition to a digital economy, memory IC sales are forecast to reach $180.4 billion…
Infineon SRAM Aiming for the Stars
Radiation hardening and low power allows for smarter on-board satellite data processing, using Infineon's new SRAMs.
Global Chip Boom Driving Foundry Expansion
Growing demand for memory chips is fueling the current wafer and foundry booms.
The Ups and Downs of Memory Stacking
A look at memory stacking techniques, advances, challenges, and best practices.