2021-06-09 - Stephen Las Marias

Micron Powering the Future of Memory

Micron highlights the latest innovations and technology developments shaping the future of memory.

2021-06-03 - Apacer

Apacer Debuts Next-Gen DDR5, Patented Compact SSDs at COMPUTEX Virtual 2021 Online

Apacer will launch stunning new products, including next-gen DDR5 and compact SSDs, at the COMPUTEX Virtual 2021 Online Exhibition this…

2021-06-02 - GlobalData

Majority of Top 20 APAC Tech Firms Managed to Post Growth in 2020

Increasing investments in digital transformation, data centers and IoT deployment were instrumental in the more than 5% average revenue growth…

2021-05-28 - Global Unichip Corp.

GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process

GUC has announced GLink-3D die-on-die interface IP using TSMC’s N5 and N6 processes, and 3DFabric packaging technology for AI, HPC,…

2021-05-25 - Gary Hilson

AI Driving Renewed Interest in Processing-in-Memory

Samsung's new processing-in-memory architecture places AI computing capabilities inside a high bandwidth memory (HBM).

2021-05-24 - Kioxia Corp.

Kioxia Expands Yokohama Tech Campus, Strengthens R&D

Kioxia is strengthening its flash memory and SSD technology development capabilities to meet increasing demand.

- IC Insights

Memory IC Industry Forecast to Achieve Record Highs in 2022

Fueled by economic recovery and the transition to a digital economy, memory IC sales are forecast to reach $180.4 billion…

2021-05-14 - Gary Hilson

Infineon SRAM Aiming for the Stars

Radiation hardening and low power allows for smarter on-board satellite data processing, using Infineon's new SRAMs.

2021-05-10 - George Leopold

Global Chip Boom Driving Foundry Expansion

Growing demand for memory chips is fueling the current wafer and foundry booms.

2021-05-07 - Gary Hilson

The Ups and Downs of Memory Stacking

A look at memory stacking techniques, advances, challenges, and best practices.