CEVA Launches Bluetooth 5.3 IP
CEVA has launched its RivieraWaves Bluetooth 5.3 IP.
Cadence and UMC Collaborate on 22ULP/ULL Reference Flow Certification
Cadence's digital full flow has been optimized and certified for UMC's 22ULP/ULL process technologies to accelerate consumer, 5G, and automotive…
Electronic System Design Industry Achieves Record Q1 Revenue Growth
The electronic system design (ESD) industry revenue rose by 17% to $3.16 billion in the first quarter of 2021, the…
Arm-Powered Fugaku Supercomputer Claims #1 Spot on Top500 for Third Time in a Row
The supercomputer Fugaku, developed by RIKEN and Fujitsu and powered by Arm technology, has claimed the top spot on the Top500…
Embedding Intelligence in Chips
Israel-based proteanTecs provides deep level visibility into chips for continuous monitoring and predictive maintenance.
GUC and Omni Design Tape Out 16nm LiDAR SoC
GUC' 16nm LiDAR SoC incorporates Omni Design’s multi-Giga sample ADC and other signal chain IP cores.
GUC Tapes Out AI/HPC/Networking Platform on TSMC CoWoS Technology
Global Unichip has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes…
Intel Looking to Acquire SiFive for $2B
Intel maybe among several companies courting SiFive for a potential acquisition or further investment.
TSMC Unveils Latest Logic, Packaging and Stacking Technologies
TSMC debuts N6RF for enhanced 5G smartphone experience, N5A for state-of-the-art automotive, and the new 3DFabric technologies.
Cadence Expands Collaboration with TSMC
As part of the collaboration, Cadence's digital and custom/analog tools have been optimized and certified for TSMC's N3 and N4…
Arm Upgrades Its Entire Portfolio of PC And Mobile IP
With this huge announcement of new IP, Arm set a new bar for not only itself but for other IP…
GUC Unveils Die-on-Die Interface IP Using TSMC N5 and N6 Process
GUC has announced GLink-3D die-on-die interface IP using TSMC’s N5 and N6 processes, and 3DFabric packaging technology for AI, HPC,…