Siemens Place-and-route Solution Now Qualified on TSMC’s N6 Technology
In addition to previous collaboration for multiple technology nodes starting from 40nm down to 7nm, Aprisa is now qualified to…
Demand for Notebooks, Networking Products Boost 2020 Revenues of Top 10 Fabless IC Design Companies
IC design revenues are expected to reach new heights in 2021.
Arm Unveils First New Architecture in a Decade
Arm's latest architecture, v9, is designed to meet the needs of modern computing, from the IoT up to supercomputers.
5 Key Considerations for Next-Gen IC Packaging Design
Next-generation IC packaging is the best path to achieve silicon scaling, functional density, and heterogeneous integration while reducing the overall…
Europe Aiming for Manufacturing Capacities for 2nm
The European Commission recently presented its 'Digital Compass', which stated the intent to have manufacturing capacities below 5nm nodes and aiming at…
IC Design: Going Back to 2-D?
ICs, once planar, had to go 3-D to keep progressing. Future progress will probably take ICs back to 2-D, however.
Chiplets to Open Up Completely New More than Moore Roadmap
The basic idea behind chiplets might not be entirely new, but the concept goes several steps further than the idea…
A Short History of Chiplets
The idea of the disagreggation of ICs into smaller physical pieces of silicon—chiplets—has been generating buzz for some time.
EDA Breakthroughs Needed to Conquer Evolving SoC Design Challenges
As system complexity continues to rise, breakthroughs are needed if EDA is to keep ahead of SoC design challenges.
Squaring the Circle: A Look at Deca Technologies’ Innovations
Deca knows new approaches are needed to continue to scale production, as well as to address the demands of "More…