2022-05-05 - Majeed Ahmad

Apple Lawsuit Puts Spotlight on SoC Design Engineering

Apple's lawsuit claims that Rivos has committed trade secret theft of its homegrown chip designs.

2022-04-29 - Applied Materials Inc.

Applied Materials Enables 2D Logic Scaling with EUV and 3D GAA

Applied Materials has launched innovations that help customers continue 2D scaling with EUV and next-generation 3D GAA transistors.

2022-04-28 - Gary Hilson

Etch Tools Continue 3D Evolution to Keep Pace with Moore’s Law

Lam Research's selective etch tools aim to help chipmakers leap from planar to 3D structures.

2022-04-22 - Majeed Ahmad

Disrupt or Be Disrupted: Intel and the Great Semiconductor Fab Game

Find out where Intel stands in its bid to compete with fab business behemoths TSMC and Samsung.

2022-04-21 - Ed Seng

A Post-Moore’s Law World

In a post-Moore's Law world, there will be lots of unknowns. Will the benefits of chiplets be realized? How will…

2022-04-11 - Gary Hilson

Chiplets Get a Formal Standard with UCIe 1.0

The recently announced UCIe 1.0 specification provides a complete standardized die–to–die interconnect with physical layer, protocol stack, software model, and…

2022-04-06 - ESD Alliance

Electronic System Design Industry Up 14.4% YoY in Q4 2021

ESD industry revenue increased by 14.4% year-on-year to $3.468 billion in Q4 2021, according to the ESD Alliance.

2022-03-25 - TrendForce

Top 10 IC Design Companies Post 2021 Revenue Topping $100B

Revenue of the global top 10 IC design companies reached $127.4 billion in 2021, up by 48% YoY, according to…

2022-03-08 - Universal Chiplet Interconnect Express

Industry Leaders Join Forces to Standardize Chiplet Ecosystem

Industry leaders have formed a consortium that will establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

2022-03-04 - Cadence Design Systems Inc.

Cadence Receives TSMC OIP Award for 3D-IC Design

Cadence has received a TSMC OIP Ecosystem Forum Customers’ Choice award for a paper titled, "Integrated Platform for 3D-IC Design."

2022-02-28 - Stelios Diamantidis, Synopsys

AI, and the Real Capacity Crisis in Chip Design

It's the dawn of the self–designing chip. AI-based chip design can relieve some of the strain on engineering teams and…

2022-02-18 - Siemens Digital Industries Software

Siemens Joins Intel Foundry Services’ EDA Alliance Program

As part of the alliance, Siemens plans to collaborate closely with IFS to optimize best-in-class IC design tools, flows and…