Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.
The TVS features patented PAR construction for a temperature range of −65°C to 185°C.
DenciTec enables the production of circuits with extremely high density without the disadvantages of the established manufacturing processes.
The MAF1005G can suppress the spurious emissions from cellular bands by up to 50dB.
The new family enables the development of flexible, standards-based platforms by providing 5X system-level performance/watt and any-to-any connectivity with the security and safety required for next-generation systems.
Developers can now tap into Apple’s Siri voice search for the first time using the latest APIs.
Xilinx extends SDSoC development environment that enables software-defined programming of the 16nm Zynq Ultrascale+ MPSoC.
Here's how you can employ PIC microcontroller and FETs to enable a four-digit voltmeter.
Characterisation tools these days offer a good solution for extracting the best performance out of an ASIC/SoC for any specified PVT operating conditions.
This versatile conversion circuit detects and displays signal's peak value. It offers a low-cost analogue-to-digital conversion and a three-digit, seven-segment display.
The RL78 model, developed by eSOL TRINITY, Imperas’ partner in Japan, provides technical support for Imperas customers as well as services for embedded software development.
In this instalment, we will look at some examples of the documentation produced during the development lifecycle for safety-critical software.