2017-04-04 - EE Times Asia

Dry etching system allows uniform Descum, Ti process

The NA-1500 dry etching system provides stable transfer and processes without abnormal discharge, according to Ulvac.

- Rick Merritt

FinFETs compete with FD-SOI

Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers.

2017-03-21 - Rick Merritt

EUV rolls into TSMC’s 7+nm node in 2018

TSMC has used an unnamed “novel resist” chemical to replace five immersion masks with one EUV mask at pitches ranging from 26-30nm.

- Rick Merritt

TSMC unveils plans for 7+, 12, 22nm nodes

TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.

- Rick Merritt

TSMC advances push into 3nm, machine learning

The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC.

- Rick Merritt

TSMC’s first-gen 7nm starts its ramp

The foundry is developing unique flavours of its processes tailored to needs of automotive, smartphone, high-performance computing and IoT markets.

2017-03-20 - Silicon Labs

Multiprotocol SoCs offer up to 19dBm output power

The Wireless Gecko SoCs support Zigbee and Thread mesh networking, Bluetooth 5 and proprietary wireless protocols, according to Silicon Labs.

2017-03-17 - Renesas

Embedded platform adds Wi-Fi software, MCUs, tests

Synergy Software Package v1.2.0 features integrated API, Wi-Fi framework, MCU series and documented SQA for a complete embedded platform.

2017-03-14 - Lapis Semiconductor

16bit MCU cuts startup power consumption by 10x

The ML62Q1000 series offers ±30kV noise resistance, operating up to 105°C for consumer electronics and industrial equipment.

2017-03-10 - Vivek Nanda

Infineon demos mobile ID in car rental use-case

Infineon held a rent-a-car demo at the recent MWC and told us that evolving the Asian use of smart token for e-Gov services towards mobile ID would be particularly appealing.

2017-01-20 - Panasonic

Flexible PCB material cuts transmission loss

Using its resin design technology, Panasonic has developed a bonding sheet that can be laminated at less than 200°C and stored at room temperature.

2017-01-09 - Synopsys

Virtual prototyping accelerates software dev’t

SoReal! Virtual Platform, based on Synopsys' Virtualiser solution, enables customers to develop, deploy and use virtual prototypes.