The NA-1500 dry etching system provides stable transfer and processes without abnormal discharge, according to Ulvac.
Intel has its own internal products already being designed for 22FL as well as hopes to attract foundry customers.
TSMC has used an unnamed “novel resist” chemical to replace five immersion masks with one EUV mask at pitches ranging from 26-30nm.
TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.
The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC.
The foundry is developing unique flavours of its processes tailored to needs of automotive, smartphone, high-performance computing and IoT markets.
The Wireless Gecko SoCs support Zigbee and Thread mesh networking, Bluetooth 5 and proprietary wireless protocols, according to Silicon Labs.
Synergy Software Package v1.2.0 features integrated API, Wi-Fi framework, MCU series and documented SQA for a complete embedded platform.
The ML62Q1000 series offers ±30kV noise resistance, operating up to 105°C for consumer electronics and industrial equipment.
Infineon held a rent-a-car demo at the recent MWC and told us that evolving the Asian use of smart token for e-Gov services towards mobile ID would be particularly appealing.
Using its resin design technology, Panasonic has developed a bonding sheet that can be laminated at less than 200°C and stored at room temperature.
SoReal! Virtual Platform, based on Synopsys' Virtualiser solution, enables customers to develop, deploy and use virtual prototypes.