2020-10-14 - George Leopold

Silicon Wafer Shipments Head for Recovery and Record High

Bullish forecasts for the silicon wafer shipments as the EDA industry thrives...

- Ansys

Ansys Expands Its Semiconductor Footprint and Stages Virtual User Conference

The rapid growth of the interest in Ansys’s semiconductor tools has prompted the company to stage a gathering of its…

2020-07-20 - Anton Shilov

How SMIC Can Keep Up With Advanced Process Technologies – Part 2

SMIC has begun producing 14nm chips, and has joined the FinFET club. The company is on the verge of a…

2020-07-17 - George Leopold

EDA Industry Maintains Healthy Growth

The EDA sector continues to expand as system-level efforts gain momentum...

2020-07-04 - Digi-Key Electronics

Digi-Key Announces Global Partnership with EAO for DPS Tool

Digi-Key announced that it has expanded its tool offerings by signing a global partnership with EAO...

2020-06-09 - George Leopold

DARPA Seeks to Embed Security Into Chip Designs

As semiconductors become the choke point in global tech wars, the U.S. looks to advance security to the IC design…

2020-06-03 - George Leopold

A Marriage of IC Security with System-Level Synthesis

A new U.S. design initiative would help silicon architects achieve system-level synthesis while incorporating security into the design process...

2019-08-13 - Junko Yoshida

AVs & EDA Speaking the Same Language

Foretellix co-founders believe car OEMs cannot verify the safety of an AV through miles-driven only. They focus on the quality…

2019-08-02 - Dylan McGrath

Blog: EDA’s Revenue Bump

With the world's two largest economies embroiled in a trade war, it has caoe as a shock that EDA revenue…

2018-07-09 - Dylan McGrath, EE Times

Cadence, Mentor Announce Cloud Services

At this year's Design Automation Conference

2018-07-06 - Dylan McGrath, EE Times

Synopsys and Mentor in Patent Settlement

Long-running patent dispute ends in settlement and collaboration agreement

2017-10-23 - Rick Merritt, EE Times

Monolithic 3D: Promise, Challenges

Researchers said monolithic 3D chip stacks have promise but face several challenges at an event attended by CEA-Leti, Qualcomm, ARM…