A majority of consumers believe hyperconnectivity driven by hyperscale computing will positively impact them within five years, according to a new report from Cadence Design Systems Inc.
Presto is adopting the Cadence system design and analysis portfolio for advanced IC packaging.
The AWR V16 advances heterogeneous technology development for 5G wireless and connected systems for automotive, radar systems and semiconductor technologies.
Sequans has successfully adopted Cadence's RF solutions to develop its next-generation 5G IoT platform.
Proposed through the JEDEC JC15 committee, the new JEDEC JEP181 standard simplifies thermal model data sharing.
The new SnapEDA search capability on DesignSpark provides engineers with millions of free CAD models, helping them design electronics faster.
Built upon proven Allegro and OrCAD core technology, the new Allegro X platform revolutionizes and streamlines the system design process for engineers.
Siemens' latest version of Nucleus ReadyStart software for Arm-based devices provides enhanced support for the Arm Cortex family of processors.
EdgeCortix has deployed multiple Cadence verification and digital tools to accelerate the design and verification of its edge AI chips.
Now certified for TSMC's N3 and N4 processes, Siemens' Analog FastSPICE platform provides leading-edge verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits.
Think of it as a new class of EDA tool—one engine to rule all the other engines in a full verification flow.