The stack offers up to 6x better images/second/watt in machine learning inference, according to Xilinx.
ZTE achieves a record–beyond a thousand images per second in facial recognition–known as “theoretical high accuracy” for its custom topology.
The new 1.27mm pitch connectors are equipped with insulation displacement connection termination technology.
Synopsys has obtained a permanent injunction in its copyright suit against EDA start-up ATopTech.
The RV32IM RISC-V core is available for Microsemi's IGLOO 2 FPGAs, SmartFusion 2 system-on-chip (SoC) FPGAs or RTG4 FPGAs.
The Galaxy Design platform certification for Samsung's 10LPP process includes design techniques for enabling less power consumption.
Compared to the Tensilica Fusion F1 DSP, Fusion G3 DSP shares the same base Xtensa ISA, while adding richer and higher-throughput DSP instructions.
The PDK provides a plug-and-play tool set with improved analogue features and device performance as well as highly accurate simulation models.
Hanoi anticipates the cooperation with Seoul in assisting with the city’s process of construction and development in e-governance, IT and teleco sectors.
Smart I/O offers flexibility for interconnection using the interconnection matrix. Users need not write any code to configure the Smart I/O block.
Smart I/O offers flexibility for interconnection using the interconnection matrix. Users need not write any code to configure the Smart I/O block.
USB 3.1 spec can be a bit intimidating when compared to the USB Micro-B connector and the FTDI USB 2.0 to UART chips most of us microcontroller folks have gotten used to. However, it is possible, not difficult, and officially supported, to wire in a Type-C connector to an existing USB 2.0 design.