STMicroelectronics' STGAP2SiCS is optimized for safe control of SiC MOSFETs and operates from a high-voltage rail up to 1.2kV.
Infineon Technologies' CoolSiC hybrid product family combines key benefits of the 650V TRENCHSTOP 5 IGBT technology and the unipolar structure of co-packed Schottky barrier CoolSiC diodes.
STMicroelectronics' TSV7722 precision high-bandwidth operational amplifier is suited to high-speed signal conditioning and accurate current measurement in power-conversion circuits and optical sensors.
The MAX17577 and MAX17578 from Maxim Integrated Products Inc. are the industry’s smallest, highest-efficiency synchronous inverting DC-DC step-down converters.
The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications.
Maxim Integrated Products Inc. has launched three new Essential Analog ICs that double the battery life and deliver robust protection and the highest accuracy for industrial and IoT applications.
What are the technical choices made by the RF front end module manufacturers and OEMs ? What are the cost differences between the modules? What are the different manufacturing process steps? How can the smartphone maker’s choices and supplier tendencies be explained? System Plus Consulting and Yole present their vision of the latest innovations in the RF front-end module industry.
The STMicroelectronics L7983 is a compact, 3V-60V, 300mA synchronous DC/DC buck converter with flexible, dynamic-mode selection to satisfy noise-sensitive applications and maximize efficiency at light load...
STMicroelectronics hs added the VIPer31 compact high-voltage converter IC to its VIPerPlus series, enables robust power-converter solutions that deliver excellent reliability and meet energy-saving eco-design norms...
ST TSV792 dual 5V op amp combines 50MHz gain-bandwidth with precision attributes including low input offset voltage and extremely low input voltage noise of just 6.5nV/√Hz...
In power electronics motor drives take up a major share in the market...
MAX25430 slashes design size up to 40 percent and eliminates microcontrollers, metal enclosures and heat sinks for 25 percent lower cost than competitive solutions