2020-05-22 - Teledyne e2v

Case study: Multi-Channel ADCs enable Machine Condition Monitoring for Industry 4.0

Inclusion of Teledyne e2v’s versatile EV10AQ190A devices has proved pivotal in data acquisition boards used to assess the ongoing operation…

2020-05-06 - Bill Schweber

Blog: Do I Shut Off That Switching Supply?

There are different ways to attenuate power-rail and system noise during precision A/D conversion cycles and, as always, there are…

2020-03-25 - Infineon Technologies

SMA and Infineon reduce system costs for inverters

Joint press release of SMA Solar Technology AG and Infineon Technologies AG

2020-03-05 - STMicroelectronics

ST Launches Highly Integrated and Flexible Synchronous DC/DC Converters

STMicroelectronics Launches Highly Integrated and Flexible Synchronous DC/DC Converters for Smart Industrial Applications.

2018-02-01 - STMicroelectronics

Interactive A/D mixed signal modeling via Foreign VHDL/Verilog C

In this article an analog-digital mixed signal modeling approach based on the conversion of analog Matlab/Simulink® model to C code…

2017-07-26 - Analog Devices

ADI’s gate drivers enable higher switching speeds

Analog Devices' ADuM4120 and ADuM4121 isolated gate drivers are designed to allow higher switching speeds of new inverter architectures.

2017-04-10 - EE Times Asia

12V buck regulators support up to 14A auxiliary rails

The ISL850xx sync buck regulators support input voltage of 3.8V to 18V and wide output current range, according to Intersil.

2017-02-08 - Texas Instruments

Op amp adopts zero-drift, zero-crossover technology

TI's zero-drift technology achieves a low maximum offset voltage of 5μV and a typical offset voltage drift of 0.005μV/°C.

2017-01-02 - Spencer Chin

AMP Consortium steps up digital power standards

The group expects to create common configuration files for plug-and-play interoperability to ensure compatibility between each company’s products.

2016-10-19 - Graham Prophet

Adjusting SiC MOSFET modules for size, reliability

The solution addresses SiC IPMs in hermetically sealed packages currently in development for harsh environments.