SPA Expects Chip Shortages to Persist Throughout 2023
Analysis from the Smart Payment Association (SPA) confirms that the global semiconductor shortage will continue throughout 2023, severely impacting the…
Cadence PHY and Controller IP in TSMC N7, N6 and N5 Process Nodes Achieves PCIe 5.0 Compliance
Cadence Design Systems Inc.'s PHY and Controller IP for the PCI Express (PCIe) 5.0 specification in the TSMC N7, N6…
Synopsys, Arm Strengthen Partnership to Advance Next-Gen Mobile SoCs
Enabling mutual customers to deliver specialized compute, high performance and high efficiency for mobile applications including laptops, smartphones, gaming and…
NXP Extends S32 Automotive Platform for New Software-Defined Vehicles
NXP Semiconductors has launched two new processor families that extend the benefits of NXP’s innovative S32 automotive platform with safe,…
Tachyum Unveils Universal Processor
Picking the right processor for the job may soon be a simpler decision for many design engineers, even in high–performance…
CBRS and 5G: Boosting the Data Rates?
Similar to later 4G networks, 5G performance will be propped up by semi–shared spectrum such as Citizens Broadband Radio Service…
IoT Digital Power Management and Power Integrity
An Internet of Things (IoT) device derives its power either from a 12-V DC supply or from a battery. In…
Ansys, TSMC Partner on Multiphysics Design Methodology for Wireless Chips
Ansys has collaborated with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) on the TSMC N6RF Design Reference Flow for TSMC's N6…
Automated Testing Remains a Significant Challenge for Organizations
Automation is gaining inroads in testing, with 75% of organizations using a combination of automated and manual testing, according to…
Carbon Nanotubes Enable No-Compromise Thermal Interface Materials
The market today requires electronic devices with advanced features and increasingly compact dimensions. The trend towards miniaturization places designers in…
IDC: Sri Lanka HCP Market Plunges 25% in 1Q22 Amid Severe Economic Crisis
Sri Lanka's hardcopy peripherals (HCP) market registered shipment of 0.03 million units in the first quarter (1Q22), declining by 2.4%…
Analog Devices Launches High-resolution Module for 3D Depth Sensing, Vision Systems
Analog Devices Inc. has launched the industry’s first high-resolution, industrial quality, indirect Time-of-Flight (iToF) module for 3D depth sensing and…
