Samtec Features Latest Rugged, High Bandwidth Interconnect Solutions
Article By : Samtec Inc
Samtec will showcase and demonstrate their latest rugged and high-performance interconnect and technologies at Computex 2019 in Taipei
Samtec Inc., a privately held $822 MM global manufacturer of a broad line of electronic interconnect solutions, will showcase and demonstrate their latest rugged and high-performance interconnect and technologies at Computex 2019 in Taipei.
Samtec high-speed technologies for Silicon-to-Silicon optimization will be on display, including new high-speed, high- bandwidth optical, board-to-board and cable-to-board interconnects, including 56 Gbps PAM4 and 112 Gbps PAM4 products.
Featured products include:
- NovaRay: The innovative design of NovaRay combines extreme density and extreme performance for 112 Gbps PAM4 per channel, in 40% less space than traditional arrays, for an industry leading 4.0 Tbps aggregate data rate.
- Samtec Flyover: As bandwidth requirements rapidly increase, routing signals through lossy PCBs, vias and other components has become one of the most complex challenges designers face. Samtec Flyover breaks the constraints of traditional substrate signaling and hardware offerings, resulting in a cost-effective, high-performance answer to the challenges of 112 Gbps bandwidth and beyond.
- FQSFP-DD: Samtec was the first interconnect company to bring the QSFP Flyover product line to market. Samtec is excited to announce another first in the Flyover realm: Samtec’s FQSFP-DD is the first product to take the Samtec Flyover architecture concept to the QSFP-DD form factor.
- AcceleRate: Samtec’s AcceleRate® cable assembly is the slimmest in the industry with a 7.6 mm body width ideal for closer proximity to the IC. The high-density 2-row design features 8 and 16 pair configurations on a 0.635 mm pitch for up to 92 pairs per square inch.