Top Stories
PCIe
2022-06-27- Gary Hilson

PCIe 7.0 To Double Data Rate – Again
artificial intelligence
2022-06-27- Sally Ward-Foxton

Training a 20-Billion Parameter AI Model on a Single Processor
Internet of Things
2022-06-24- Teledyne LeCroy

Debugging Ethernet, SATA, and PCIe for IoT Devices
AI
2022-06-24- Sally Ward-Foxton

Neuchips Tapes Out Recommendation Accelerator for World-Beating Accuracy
SiC
2022-06-24- Peter Gammon, Arne Benjamin Renz and Guy Baker

Assessing the Potential of SiC Beyond the Automotive Industry
Keysight
2022-06-23- Elizabeth Ruetsch, Keysight Technologies

Quantum’s Disruptive Promise: Niche to Mainstream
TSMC
2022-06-23- Alan Patterson

TSMC Creates Design Options for New 3nm Node

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2022 a Focus for 12-inch Capacity Expansion

Digi-Key

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GlobalFoundries

GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool

DRAM

TrendForce: DRAM Pricing Forecast to Drop in 3Q22

Imec

imec’s Direct-digitization Readout Design Enables Small, Low-noise, Low-power Neural Interfaces

Brewer Science

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IC Insights

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Asia Likely to Lead Record Fab Expansions in 2022

LEARNING STUDIO

Webinars
2022/06/14

Functional Safety and Security in NOR Memories

XENSIV™ TLE4972 – Infineon coreless current sensor is ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches

Calibre Full Chip Integration & Interface flows

Achieving High Defect Coverage for Safety Critical and High Reliability Designs

How to improve Modelsim Simulation Performance

Downloads

Performing Strain Gauge Measurements with the Keithley DAQ6510 and KickStart Software

Making Measurements on 3-Phase Motor Drives with an Oscilloscope

Getting Started with Oscilloscope Automation and Python

5G NR Multi-Channel System Troubleshooting across Time, RF and Digital Domains

Pre-compensation Can “Correct” Your AWG Signal

Special Reports
AI

In Focus: AI/ML

In Focus: Automotive Electronics

Green Engineering

GaN/SiC Developments

In Focus: Medical Electronics

AutomotiveMore +

NXP Extends S32 Automotive Platform for New Software-Defined Vehicles

STMicroelectronics Releases CCC Release 3-compliant In-Vehicle SoC for Secure Car Access

StradVision Powers LG Electronics’ New ADAS Camera System

Perspectives on Automotive Operating Systems

5GMore +

CBRS and 5G: Boosting the Data Rates?

Getting Aboard the 5G Train

How the Expansion of 5G Will Transform Telemedicine and Health-Care Delivery

Lattice ORAN Solution Stack Accelerates 5G Customer Deployments

In AsiaMore +

IDC ASEAN Top ICT Predictions for 2022 and Beyond

ITRI VLSI-TSA and VLSI-DAT Symposia Kicks Off in April 2022

Execs Remain Optimistic That Innovation is the Way Out

Amkor Plans New Vietnam Factory to Expand Advanced Packaging Technology Capacity

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【Webinar】Calibre Full Chip Integration & Interface flows

Calibre DESIGNrev tool is a fast and flexible chip-finishing platform that helps speed up design completion and tape-outs by rapidly loading, displaying, and editing large GDSII and OASIS layouts whereas the Calibre Foreign Database Interface (FDI) utilities...