Infineon Launches Industrial WLCSP eSIM

Article By : Nitin Dahad, EE Times

Meets JEDEC standards exceeding those of consumer-grade products

LONDON — Infineon says it has shipped volume quantities of the first industrial-grade wafer level chip scale package (WLCSP) embedded SIM.

Until now, the company said there were only consumer-grade eSIM products being shipped in a WLCSP-package. Infineon says it has managed to get its SLM 97 security controller qualified to industrial qualification requirements as defined per Jedec, including extended temperature range (-40 to 105°C) and reduced failure rates.

Manufacturers of industrial machines and equipment ranging from vending machines to remote sensors and asset trackers are using machine-to-machine communication in the internet of things (IoT), and often rely on mobile networks for data collection and uninterrupted data transmission. A chip level miniature eSIM can be helpful in the adoption of cellular connectivity into industrial environments — the small eSIM footprint enables more design flexibility and simplified production processes for device manufacturers. Customers can also change their mobile service provider at any time, for example, if the quality of the network deteriorates or in the event of a better contract from the mobile operator.

Infineon's SLM 97 with miniaturized wafer-level chip scale package.
Infineon’s SLM 97 with miniaturized wafer-level chip scale package.

However, providing robust quality on a miniature footprint that works even under harsh industrial conditions has been a challenge for silicon providers. Infineon says it has addressed this challenge with the SLM 97 security controller, which measures only 2.5mm x 2.7mm in size.The security chip in WLCSP is manufactured at Infineon’s production site in Dresden and Regensburg and now available in volume quantities.

Subscribe to Newsletter

Leave a comment