Over 3,000 million square inches of silicon wafers shipped out in the first quarter of 2018
TAIPEI — SEMI has announced record numbers in silicon wafer shipments, as measured by wafer area, seeing worldwide shipments breach the 3,000 million square inch mark for the first time ever in the first quarter of 2018. The 3,084 million square inches shipped represent a quarter-on-quarter growth of 3.6 percent over the last quarter of 2017, and a 7.9 percent hike year-on-year.
“Global silicon wafer shipment volumes started the year at historic levels,” said Neil Weaver, chairman SEMI SMG and Director, Product Development and Applications Engineering of Shin-Etsu Handotai America. “As a result, silicon shipments, like device shipments, are positioned to be strong this year.”
The previous quarterly record was set in the third quarter of 2017, with 2,997 sq.in. of virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped by the wafer manufacturers to end users.
— Jonas Klar is an editor for EE Times Asia