Top Stories
Electric Vehicles
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E-Mobility: How to Build a Talent Pool
Communications
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Semiconductor
2022-08-10- Alan Patterson

Micron to Invest $40B in U.S. with Passage of CHIPS Act
Optoelectronics
2022-08-08- Anne-Françoise Pelé

Scintil Photonics Speeds Up Communications in Data Centers
Optoelectronics
2022-08-05- Martin Vallo and Eric Mounier

Global Insights into the Co-Packaged Optics Technology Platform
Semiconductors
2022-08-05- TrendForce

Intel Orders Delayed, TSMC Slows 3nm Expansion
Test and Measurement
2022-08-03- Andrew Herrera, Keysight Technologies

Robotic Process Automation Optimizes Test Instrumentation

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Hot Topic
Market News

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LEARNING STUDIO

Webinars
2022/08/03

MOSFIT: Infineon Automotive MOSFET Riding Innovative Design

Infineon Automotive MOSFET Addressing The Market Development & World Class Quality

Functional Safety and Security in NOR Memories

XENSIV™ TLE4972 – Infineon coreless current sensor is ideal for xEV applications like traction inverters used in hybrid and battery-driven vehicles, as well as for battery main switches

Calibre Full Chip Integration & Interface flows

Downloads

Deliver 3D IC innovations faster

System-level connectivity management and verification of 3D IC heterogeneous assemblies

Proposed standardization of chiplet models for heterogenous integration

Five key workflows that deliver 3D IC packaging success

What Issues Drive Image Sensor Choice for ITS and other Machine Vision Applications?

Special Reports
IoT

In Focus: IoT

In Focus: AI/ML

In Focus: Automotive Electronics

Green Engineering

GaN/SiC Developments

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Newsight Imaging Joins NVIDIA Inception

How Baidu Apollo Rolls in the AV Industry

Cars That Think Like You

Cadence and Tower Semiconductor Expand Collaboration to Accelerate Auto Chip Development

5GMore +

TMYTEK Solution Day 2022 Presents mmWave Solutions for 5G/B5G and SATCOM Applications

Antenna Design Considerations for 5G Applications

5G Today and Into the Future: A Technical Overview of Release 16, 17, 18 and Beyond

CBRS and 5G: Boosting the Data Rates?

In AsiaMore +

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【Webinar】MOSFIT: Infineon Automotive MOSFET Riding Innovative Design

At Infineon we are committed to maintaining our innovation leadership in automotive MOSFET. From the Top Side cooling package in 10x12mm2 to the newly developed Half Bridge 5x6mm2 leadless package for motor drive and body applications, our MOSFETs are available in variety packages for ultimate design flexibility.