A new solder paste formula from precision fluid dispensing systems manufacturer Nordson claims to improve bond reliability in applications that require attaching an antenna electrically connected to a chip, such as in RFID tags, dual interface smart cards and biometric passports.

Manufacturers often use a silver filled epoxy to bond these components, but this method requires a curing process, which can affect bond strength if not enough time is allotted for complete curing. Other process considerations include low storage temperature requirements of 0°C.

Nordson said its SolderPlus paste doesn’t require curing time and can be stored at a higher temperature, requiring less time to thaw.

In addition, the chemistry of solder paste makes it safer to use when compared to the chemistry of silver filled epoxy, which contains toxic materials, according to the company. Solder paste is also much less expensive because it contains no silver.