The flex and rigid flex circuit assembly technology offers smaller form factor and reduced weight for military and aerospace equipment.
By combining the latest laminates, mil-aero connectors and advanced circuit fabrication techniques, manufacturing solutions company Sanmina has developed new flex and rigid flex circuit assembly capabilities for military and aerospace electronics equipment.
Flex and rigid flex circuits have been used as a cost-effective interconnect system in mission critical defence and aerospace equipment, but as these systems evolve and data rates increase, performance requirements for interconnect become more demanding. Flex circuit laminate materials have since evolved and, with Sanmina’s advanced processes, can now be used with these high speed connectors in demanding applications. Sanmina’s flex and rigid flex technology in these applications results in a smaller form factor, reduced weight and cost savings, according to the company.
Sanmina’s new flex and rigid flex circuit fabrication technology is able to deliver data rates up to 10-15Gb/sec.
Sanmina, a technology innovator in high performance interconnect systems, offers a complete solution for backplanes, PCBs and flex circuits, including systems engineering, board design and layout, in-house laminate qualification, signal integrity, high speed connector analysis and failure analysis laboratories.
The company’s global facilities are fully certified for defence and aerospace requirements including ITAR and AS9100C certifications, among others. In the South Asia Pacific region, Sanmina has established plants in Chennai, India; Batam, Indonesia; Penang, Malaysia; Chai Chee and Penjuru in Singapore; and in Pathum Thani, Thailand.