System developers can leverage the Renesas IoT Sandbox to develop end-to-end prototypes for IoT applications.
The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond pressure.
The Wireless Gecko SoCs support Zigbee and Thread mesh networking, Bluetooth 5 and proprietary wireless protocols, according to Silicon Labs.
Layers of MXenes can be combined to engineer ultrathin electronics, sensors, batteries, supercapacitors and catalysts, researchers say.
The stack offers up to 6x better images/second/watt in machine learning inference, according to Xilinx.
Semiconductor shipments are forecast to exceed 1 trillion units in 2018, with 75% of them expected to be opto-sensor-discretes, says IC Insights.
Integrated into a single chip, the X4 UWB impulse radar SoC combines a transmitter, which can operate at centre frequencies of up to 8.748GHz.
Infineon’s 60GHz 2Tx/4Rx radar IC with antenna and the 70dB SNR microphone help locate voice source amidst ambient noise.
The module merges Occipital’s Structure Core embeddable depth sensor with Inuitive’s NU3000 depth processing chip.
The key to advancing industrial IoT is for more machines, more companies and more people to interconnect, interoperate and share data.