Murata is after a patented power conversion technology that can give its subsidiary, Peregrine, an efficiency and size (smaller) boost.
The ISOW7841 reduces device operating temperature by up to 40°C, resulting in higher power delivery and higher channel count, according to TI.
TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.
TSMC has used an unnamed “novel resist” chemical to replace five immersion masks with one EUV mask at pitches ranging from 26-30nm.
The foundry is developing unique flavours of its processes tailored to needs of automotive, smartphone, high-performance computing and IoT markets.
Semiconductor shipments are forecast to exceed 1 trillion units in 2018, with 75% of them expected to be opto-sensor-discretes, says IC Insights.
Weltrend’s WT6615F and WT6632F USB power delivery controllers support from 3V up to 30V range without an external LDO.
DCT’s SoC has been tapped by European THINGS2DO project to help create a camera-based ADAS reference platform using its data protection features.
UMC’s 14nm FinFET wafers feature 55% higher speed and twice the gate density over 28nm process technology.
The RSL10 provides a voltage supply range between 1.1 and 3.6V without an external DC/DC converter, according to On Semiconductor.