The T3 robots are designed primarily for simple material handling applications, such as test machine loading and unloading.
Future higher-end products will require package substrates with L/S <10/10µm and boards with L/S <30/30µm, analysts say.
While chip-scale packages are new to the LED industry, taking <1% of the market share, Yole Développement sees them taking 6% of the market by 2021...
Roll-to-roll processing with advanced laser drilling capabilities have realised economies of scale for flex-circuit suppliers, allowing wider use in s...
Automated optical inspection and direct imaging are ensuring higher yields for flexible circuit makers.
Some vendors are calling for the Electronics Manufacturing Service sector to adopt some version of automation standards already in use in fabs.
The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond pressure.
Layers of MXenes can be combined to engineer ultrathin electronics, sensors, batteries, supercapacitors and catalysts, researchers say.
The DW Pre Tex diamond-wire sawing for wafers and cells is a one-step, inline wet process that achieves an R< 23% reflection value.
The Custom Compiler integrates with Synopsys circuit tools to provide UMC 14nm process users with a complete custom design solution.