The T3 robots are designed primarily for simple material handling applications, such as test machine loading and unloading.
The DesignWare tRoot H5 HSM provides SoCs with a unique identity that cannot be tampered with, according to Synopsys.
Future higher-end products will require package substrates with L/S <10/10µm and boards with L/S <30/30µm, analysts say.
While chip-scale packages are new to the LED industry, taking <1% of the market share, Yole Développement sees them taking 6% of the market by 2021...
Some vendors are calling for the Electronics Manufacturing Service sector to adopt some version of automation standards already in use in fabs.
TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.
TSMC has used an unnamed “novel resist” chemical to replace five immersion masks with one EUV mask at pitches ranging from 26-30nm.
The foundry is developing unique flavours of its processes tailored to needs of automotive, smartphone, high-performance computing and IoT markets.
The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC.
Ethernet GigEpack features 48Gb Ethernet ICs, USB 3.1 Gen 1connector and is supported by a series of Microchip switches, PHYs and LANs.