Murata is after a patented power conversion technology that can give its subsidiary, Peregrine, an efficiency and size (smaller) boost.
The ISOW7841 reduces device operating temperature by up to 40°C, resulting in higher power delivery and higher channel count, according to TI.
Layers of MXenes can be combined to engineer ultrathin electronics, sensors, batteries, supercapacitors and catalysts, researchers say.
The DW Pre Tex diamond-wire sawing for wafers and cells is a one-step, inline wet process that achieves an R< 23% reflection value.
NASA has come up with a real-time, ultrasound-based device that sends an acoustic wave through the crimp assembly as it is being made.
Charge and discharge cycles degrade sodium-ion batteries' performance, but little was known about their degradation mechanisms. Until now.
Linear Technology’s LT8304/-1 isolated flyback regulator generates up to 24W and produces 1kV output voltage in ±5% regulation result.
The ASML NXE:3400B EUV lithography scanner runs at 148W to produce 104 wafers/h, capable of creating overlays within a 3nm tolerance.
Co-optimisation tools are now becoming mainstream to help translate between different worlds of chip designers and lithographers.
Inspections of up to 14nm mask defects or a detector supporting 2,000Hz frame rate are just two uphill tests to be at par with EUV wavelength.