Molex Impact zX2 backplane connector system lowers impedance to 95Ω to ensure optimal SI performance amidst increasing data rates.
STMicroelectronics’ two prototype boards are based on LoRaWAN modules, with 13mm x 12mm size and power consumption range of 1.2μA in standby mode.
The FLINGO project focuses on the functional layers and processes to develop LEDs for lifetime electrical resistance and improved light extraction.
Xiaomi’s new SoC, based on eight ARM A53 cores, is capable of LTE Cat 6.
Fujitsu’s referenceless CDR cuts down optical modules’ power to 70%, enabling high traffic transmission through denser implementations.
TI's zero-drift technology achieves a low maximum offset voltage of 5μV and a typical offset voltage drift of 0.005μV/°C.
While a DSRC mandate is imminent in the U.S., ABI Research expects cellular V2X’s steady growth, reaching 300 million global subscriptions by 2030.
ZTE achieves a record–beyond a thousand images per second in facial recognition–known as “theoretical high accuracy” for its custom topology.
With built-in seals mould and crimp-and-poke insertion, Molex ValuSeal wire-to-wire connector system provides cost-effective sealed performance.
The new 1.27mm pitch connectors are equipped with insulation displacement connection termination technology.