The AT&S Toolbox uses technologies such as insulated metallic substrate, flexible PCBs, interposers and chip embedding to deliver substrate-like print...
The MEMS & Sensors Industry Group's "strategic association partnership" with SEMI, helps the latter diversify its interests.
The ring focuses the plasma directly over the wafer to speed up the etching process and provide uniform plasma coverage.
2016 is a turning point for the fan-out market since Apple and TSMC changed the game, possibly creating a trend of acceptance of fan-out packages.
The Singapore centre conducts multi-disciplinary research to develop new innovations for fan-out wafer-level packaging.
TSMC also certifies the complete suite of Synopsys' digital, signoff and custom implementation tools for the 7nm node.
Evince Technology is developing a new family of devices including a diode, an embedded field emission triode and a bidirectional switch.
Incidents involving Samsung's latest smartphone may encourage mobile device makers to re-examine the integrity of their power trains.
As new mobile applications emerge, the challenges to battery management systems increase.
Through appropriate doping, the researchers expect the novel material to lend itself to many applications in the electronic industry.