The 10LPE process uses triple-patterning lithography to deliver up to a 30% area shrink, 27% higher performance or 40% lower power than 14nm process.
Samsung’s slowdown is in part due to expectations TSMC is grabbing most of the business making Apple A-series processors in the new iPhone 7.
The technology is built around a planar nano-transistor, in which the conducting channel and gate structure are co-planar.
TSVs have become the preferred interconnect choice for high-end memory, and an enabling technology for heterogeneous integration of logic circuits.
300mm wafers, which represented 63.1% of worldwide capacity in 2015, are forecast to increase to about 68% by the end of 2020.
MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage.
The acquisition will help X-Fab, a foundry with significant operations in Malaysia, to nearly double its 8-inch capacity.
The Innovation Acceleration Services focus on prototyping and procurement and supply chain management.
MRAM is being tipped as the prime embedded non-volatile memory option at 28nm.
Less-than-40nm pure-play foundry market is expected increase by $3.6 billion this year, according to IC Insights. And TSMC continues to lead.