Asia-Pacific PC shipments have reached 24.7 million units in the third quarter of 2016, a 7.6% decline from the third quarter of 2015.
The GaN power market, however, remains small compared to the gigantic $335 billion silicon semiconductor market.
TSVs have become the preferred interconnect choice for high-end memory, and an enabling technology for heterogeneous integration of logic circuits.
Gartner expects that by 2020, a natural-language interaction could be delivered that creates scenarios with significantly improved value.
300mm wafers, which represented 63.1% of worldwide capacity in 2015, are forecast to increase to about 68% by the end of 2020.
Less-than-40nm pure-play foundry market is expected increase by $3.6 billion this year, according to IC Insights. And TSMC continues to lead.
2016 is a sequel to the M&A mania of 2015, ringing $55.3 billion in M&A agreement value in 3 quarters.
2016 is a turning point for the fan-out market since Apple and TSMC changed the game, possibly creating a trend of acceptance of fan-out packages.
What will the analog rankings look like when 2016 is over?
However, year-over-year global revenue growth from semiconductors used in medical imaging is flat, due to optical component price erosion.