Press-fit stacking connectors satisfy the need for 10Gb/s digital signals in high density packaging.
Infineon has partnered with Chinese companies and government to establish the Open Laboratory for Smart Home Interconnection Security in Beijing.
The TVS features patented PAR construction for a temperature range of −65°C to 185°C.
To improve defect coverage, Synopsys has been collaborating with semiconductor companies to advance testing and diagnostics methods for 7nm processes....
The acquisition extends Siemens Digital Enterprise Software portfolio with the addition of Mentor’s electronics IC and systems design solutions.
Ansys is expanding its sofware portfolio to go beyond simulation and include systems safety analysis, reliability engineering and quality management.
Most early adopters believe little organisational change will be necessary to integrate IoT into their day-to-day operations. Are they right?
300mm wafers, which represented 63.1% of worldwide capacity in 2015, are forecast to increase to about 68% by the end of 2020.
Micrium’s RTOS software has been ported to more than 50 microcontroller architectures.
MagnaChip plans to merge Slim Flash into various technologies, including BCD and high voltage.