Western Digital plans to release storage-class memory products based on 3D ReRAM within a couple of years.
A first of its kind in the region for Mellanox, the joint office and hi-tech solutions centre is expected to be fully operational by November.
Micron revealed performance data of working SSDs based on 3D XPoint memory, while rival Toshiba showed progress on conventional NAND flash.
The 88NV1160 can be used in a single ball grid array package SSD, as well as in a standalone controller in a 9mm x 10mm package.
With NAND flash memory arranged in a matrix, Flashmatrix enables multiple data sets to be accessed in parallel and scaled linearly.
New single-package ball grid array SSDs can accommodate up to 512GB in 16mm × 20mm NVMe SSD form factor.
Chip maker MediaTek says it has underestimated the supply of chips it would need from its foundry partners.
Non-volatile memory is still limited to niche markets due to limited densities, but this will change in the near future.
Samsung's roadmap shows two phases of rollout for 28FDSOI: eFlash risk production by the end of 2017 and the eMRAM risk production by the end of 2018....
Cell phone IC market CAGR will exceed total IC market CAGR by 3 points, according to IC Insights.