TSVs have become the preferred interconnect choice for high-end memory, and an enabling technology for heterogeneous integration of logic circuits.
The high electron mobility of IGZO allows for transistor miniaturisation and circuit thinning, according to Sharp.
As many as five of Qualcomm's chips are inside the Pixel phones, the Snapdragon 821, two PMICs, an audio codec and a Wi-Fi/Bluetooth combo chip.
The higher operating temperature helps Toshiba meet demand for such applications as semiconductor testers.
Data throughput of the 8k and 16k models is beyond 3GB/s on a single CX4 cable to aid inspection reliability.
The Taiwanese research centre has adopted a transparent plastic cover plate with gas barrier and touch functions on top of the flexible display.
The highly sensitive dots provide wider dynamic range and work in a broader spectrum area that silicon.
Toshiba claims the photocouplers can assure a propagation delay time of 20ns (max), pulse width distortion of 8ns (max) and propagation delay skew of ...
The edge-to-edge bezel-less ALCD TV displays use AUO's self-developed GOA technology to significantly lower the number of display driver ICs.
An 8ch sink type output is incorporated into the small surface-mounting packages, enabling space-saving control of multiple circuits.