The ring focuses the plasma directly over the wafer to speed up the etching process and provide uniform plasma coverage.
2016 is a turning point for the fan-out market since Apple and TSMC changed the game, possibly creating a trend of acceptance of fan-out packages.
The technology reduces the volume of internal GPU memory used by over 40%.
The Singapore centre conducts multi-disciplinary research to develop new innovations for fan-out wafer-level packaging.
Bringing together two established industry leaders, ON Semiconductor’s acquisition of Fairchild Semiconductor creates one extraordinary company.
TSMC also certifies the complete suite of Synopsys' digital, signoff and custom implementation tools for the 7nm node.
While IoT devices are embedded systems, not all embedded systems are IoT devices. At least, not yet.
If reports are true, China’s crash fatality in January presents a problem for Tesla.
A university group in Colombia developing a RISC-V-based microcontroller is a sign of the country's intention to make its mark in technology.
The merger is aimed at the combined company’s top-line business growth.