STMicroelectronics has worked with a China-based voice-recognition cloud services to design a voice-enabled IoT development platform for the Chinese l...
The LP Series filters offer low insertion loss and sharp roll-off for high frequency wireless applications, such as mobile comms, satellite TV receive...
Some vendors are calling for the Electronics Manufacturing Service sector to adopt some version of automation standards already in use in fabs.
The low temperature hybrid wafer bonding allows wafers to be bonded with fine pitch 3D electrical interconnect without requiring bond pressure.
TSMC has clearly focused on easing migrations for designers, sometimes at the expense of advances measured in single digits.
TSMC has used an unnamed “novel resist” chemical to replace five immersion masks with one EUV mask at pitches ranging from 26-30nm.
The foundry is developing unique flavours of its processes tailored to needs of automotive, smartphone, high-performance computing and IoT markets.
The six-track 12nm FinFET process is an upgrade for midrange mobile and video processors and high-end IoT devices using 16FFC, according to TSMC.
Ethernet GigEpack features 48Gb Ethernet ICs, USB 3.1 Gen 1connector and is supported by a series of Microchip switches, PHYs and LANs.
The Wireless Gecko SoCs support Zigbee and Thread mesh networking, Bluetooth 5 and proprietary wireless protocols, according to Silicon Labs.