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Clamping of high power RF transistors and RFICs in over-molded plastic packages
Author: Mahesh Shah, Richard Rowan, Lu Li, Quan Li, Eddie Mares, Leonard Pelletier

This application note provides customers with a guide for mounting high power RF transistors and RFICs in over-molded plastic (OMP) packages by clamping down the RF power device in the power amplifier housing.

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