Analyst: Stay away from 450mm
Author: Dylan McGrath

Semiconductor equipment vendors should boycott development of tools for the transition to 450mm wafers, The Information Network analyst warned, saying chip gear vendors were the losers in the transition to 300mm wafers and would likely not benefit from the next move to larger wafers.

Please login or register with us to view this article>>

Not yet registered?

Quick Register now and be part of the EE Times Asia community!

Email address:
Password:
Confirm password:
Company name:
Job function:
Products/Services:
Country/Area:

Click hereto fill out other information details. You can also subscribe to eeNews and apply to receive a copy of the magazine.

Registered already? Login to view complete content.

Email address:
Password:
	Password is case-sensitive.
	Remember password Forgot your password?

	If you have already registered on the following websites, please log in using your email address and password
EE Times-Asia sites: EE Times-India EE Times-Taiwan EE Times-Korea EE Times-China Analog/Mix signal Power Systems Embedded Design India Power Design India Home Entertainment Handheld Device Industrial Controls Auto Electronics

If you have already registered on the following websites, please log in using your email address and password

EE Times-Asia sites:

	Latest News
CapSense Express—creating reference designs with 1CS/2CS button devices (2009-11-05) Power supply controller provides flexible monitoring (2009-11-05) Ultra-linear, push-pull amps tailored for CATVs (2009-11-05) SoC simplifies full-HD multimedia display design (2009-11-05) LNAs improve GPS receiver sensitivity (2009-11-05) Network analyzer suits high-speed digital comm apps (2009-11-05) MCUs deliver 32bit performance at 16bit code (2009-11-05) Broadband market withstands recession (2009-11-05)

Talkback

eeForum:
Demystifying Vietnam
What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

Top tech resources

1.Web server design using soft processor(1,287views)

2. Address challenges in DVB-H (1,254views)

3. Using GMR sensors with scan interface (974views)

4. Simple glass breakage detector (970views)

5. Serial flash boot loader (883views)

India Newsletter

1.Broadening the Indian market

2.Unshackling broadband in India

3.IEEE 1394 networks car infotainment

4.Network your home entertainment with HomePNA

eMedia Asia	EE Times - India\|Embedded Design India\|Power Design - India\|\|\|
Global Sources	\|\|\|Electronic Components\|Computer Products\|Trade Show Center
TechInsights	EE Times\|ESM Online\|EE Times JAPAN