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Sign-off smartly with SSTA
Author: Chin-Chi Teng, Rahul Deokar

At the 45nm process node, the SSTA approach to sign-off will allow designers to mitigate the effects of process variation, prevent silicon failures, and meet the demands of cutting-edge electronic design for the near future. It will usher in the much-anticipated "electrical DFM" that provides multi-objective placement, physical synthesis, and routing optimization while comprehending the full spectrum of physical and electrical implications of manufacturing.

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