Home | Login | Register Now   [Nov 21,2009]
Global Sources
EE Times-Asia
For Registered Users Home / For Registered Users

Thermal pillar copper tech helps cool flip-chips
Author: R. Colin Johnson

Nextreme claims to have solved the overheating problem with modern flip-chips with its thermal copper pillar bumps, which can either help cool chips, or can be used in reverse to generate energy from waste heat.

Please login or register with us to view this article>>


If you have already registered on the following websites, please log in using your email address and password

EE Times-Asia sites:

Talkback

eeForum:
Demystifying Vietnam

What does Vietnam offer that a rising number of top-tier semiconductor companies are setting up and expanding operations there?

more

 
Top tech resources
 
India Newsletter
 
Go to top