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Power Quad Flat No-Lead (PQFN) package
Author: Freescale Semiconductor

The PQFN is a surface mount plastic package with lead pads located on the bottom surface of the package. All PQFN packages have either been designed with a single exposed die pad (flag) or multiple exposed die pads depending on device requirements and intended application. The industry standardization committee, JEDEC, has given a registered designator of MO-251 to describe the family of single exposed pad PQFN packages.

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