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3D integration tech thins down 300mm wafer to 4µm

Posted: 23 Jun 2014     Print Version  Bookmark and Share

Keywords:TIT  thinning  memory 

[Summary of tips] A Tokyo Institute of Technology (TIT) research has yielded a technology for the ultra-thinning process down to 4µm.In collaboration with DISCO Corporation, Fujitsu Laboratories Ltd, PEZY Computing, and the WOW Alliance, TIT Professor Takayuki Ohba has implemented the process using a 300mm 2G bit DRAM memory.It was confirme......
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