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Kingyoup bonding equipment addresses miniaturisation

Posted: 16 Jun 2014     Print Version  Bookmark and Share

Keywords:temporary bonding  debonding  Kingyoup 

[Summary of tips] Taiwan-based start-up Kingyoup Optronics Co., Ltd revealed its temporary bonding and de-bonding equipment co-developed with IBM at the IEEE Electronics Components and Technology Conference (ECTC) held in Florida last month. The temporary bonding and de-bonding equipment is specially designed to meet the microelectronics miniatu......
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