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Wafer-to-wafer bonding pulls off sub-micron accuracy

Posted: 28 May 2014     Print Version  Bookmark and Share

Keywords:sub-micron  bonding  wafer-to-wafer  fine-pitch 

[Summary of tips] Ziptronix Inc. and EV Group (EVG) have carried out sub-micron post-bond alignment accuracy on customer-provided 300mm DRAM wafers. The results were achieved by implementing Ziptronix's DBI Hybrid Bonding technology on an EVG Gemini FB production fusion bonder and SmartView NT bond aligner. This approach can be used to manufactu......
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