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Address SoC routing congestion with 2.5D SiP

Posted: 05 Jun 2014  Print Version  Bookmark and Share

Keywords:embedded systems  System on Chip  SoC  System in Package  SiP 

[Summary of tips] Not very long ago, embedded systems were made up of logic spread across multiple chips—for example, the CPU sub-system. Memory, the analogue components, and so on, were each on their own IC. The advantage was that each chip could be independently designed at its appropriate process technology node (90nm, 130nm, etc.). How......
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