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Assembly handling, thermal mgmt for lidless FC-PBGA

Posted: 26 May 2014     Print Version  Bookmark and Share

Keywords:assembly handling  thermal management  lidless  Flip Chip  Plastic Ball Grid Array 

[Summary of tips] This application note provides recommendations on the assembly handling and application of thermal management solutions for lidless Flip Chip Plastic Ball Grid Array (FCPBGA) components. Freescale's FC-PBGA is a laminate-based BGA packaging solution that provides competitive solutions for higher performance applications. &......
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